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Chip scale packages: Lumileds debuts new LED, Plessey integrates optics into CSP LED

Lumileds has announced its CSP-based FlipChip White LED intended for general illumination applications, while Plessey has developed a way to customize primary optics on a CSP LED in the manufacturing process. The original version of this article can be found...

Understand both static and transient thermal management in LED-based developments (MAGAZINE)

Giles Humpston explains the intricacies of cooling LEDs and modeling the thermal path to ensure reliable solid-state lighting product developments. The original version of this article can be found...

IES explores luminuous flux maintenance projection method developments using LM-80 data

The IES is considering feedback from the LED industry on projection methods for testing and defining additional long-term behavior changes in LEDs that are not addressed in the current version of TM-21. Jianzhong Jiao describes possible models and updates under...

CSP LEDs crawl toward delivering on SSL promise (MAGAZINE)

Chip-scale packaging (CSP) technology has the potential to reduce LED component cost and provide SSL system-design advantages, explains Maury Wright, but the technology, borrowed from the mainstream semiconductor industry, has been slow to emerge commercially. The...

Plessey announces silicon-LED case study, die, and filaments

GaN-on-Si specialist retrofits its Plymouth manufacturing facility with light engines based on its LEDs while also announcing new LED die products and filaments for retro-styled SSL lamps. The original version of this article can be found...