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Chip scale packages: Lumileds debuts new LED, Plessey integrates optics into CSP LED

Lumileds has announced its CSP-based FlipChip White LED intended for general illumination applications, while Plessey has developed a way to customize primary optics on a CSP LED in the manufacturing process. The original version of this article can be found...

Understand both static and transient thermal management in LED-based developments (MAGAZINE)

Giles Humpston explains the intricacies of cooling LEDs and modeling the thermal path to ensure reliable solid-state lighting product developments. The original version of this article can be found...

IES explores luminuous flux maintenance projection method developments using LM-80 data

The IES is considering feedback from the LED industry on projection methods for testing and defining additional long-term behavior changes in LEDs that are not addressed in the current version of TM-21. Jianzhong Jiao describes possible models and updates under...

CSP LEDs crawl toward delivering on SSL promise (MAGAZINE)

Chip-scale packaging (CSP) technology has the potential to reduce LED component cost and provide SSL system-design advantages, explains Maury Wright, but the technology, borrowed from the mainstream semiconductor industry, has been slow to emerge commercially. The...

Plessey announces silicon-LED case study, die, and filaments

GaN-on-Si specialist retrofits its Plymouth manufacturing facility with light engines based on its LEDs while also announcing new LED die products and filaments for retro-styled SSL lamps. The original version of this article can be found...

Bridgelux to become CEC subsidiary, spin out Xenio smart lighting

LED maker Bridgelux will get closer ties with existing supply-chain partners after the planned acquisition by China Electronics Company, while the recently-announced, Xenio-branded, smart-lighting products will get a new corporate home. The original version of this...