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Samsung's Tarn reports progress in CSP LEDs and GaN-on-Si LEDs

General-illumination lighting products will emerge in the coming months that utilize Samsung chip-scale-package (CSP) LEDs while the company is now supplying LEDs for smartphone camera-flash applications based on silicon-substrate technology. The original version of...

LED datasheet standard enhances manufacturer-developer communications (MAGAZINE)

An ANSI-accredited standards group within NEMA is publishing a standard describing the parameters and characterizations required on LED datasheets, reports Jianzhong Jiao, and the result will allow developers to more easily contrast and compare LEDs from multiple...

Popping the charts: Strategies Unlimited unveils SSL market data (MAGAZINE)

Market research presentations in the Plenary sessions at Strategies in Light projected growth segments in the lighting and packaged LED sectors, and chronicled the challenges being posed by price erosion, reports Maury Wright. The original version of this article can...

Choice of thermal management materials takes the heat out of LED packaging (MAGAZINE)

John Cafferkey examines the most effective packaging options for thermal management in high-power LEDs, including a detailed look at the most common LED architecture and package types. The original version of this article can be found...

Packaged LED leader Nichia leverages Future Lighting Solutions to boost general illumination sales (MAGAZINE)

Maury Wright interviews Future Lighting Solutions vice president Jamie Singerman on the distributor’s partnership with packaged LED manufacturer Nichia, a deal announced at Light+Building, and the latest in Future’s programs to help accelerate SSL...

Packaged LED architectures advance across types and applications

Today, packaged LED manufacturers offer products specific to most every application you can imagine, and you can choose from high-power, COB, mid-power, CSP, and other options. We have advancements in white and color components, and for that matter in UV and IR...