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Chip scale packages: Lumileds debuts new LED, Plessey integrates optics into CSP LED

Lumileds has announced its CSP-based FlipChip White LED intended for general illumination applications, while Plessey has developed a way to customize primary optics on a CSP LED in the manufacturing process. The original version of this article can be found...

Chip scale packages: Lumileds debuts new LED, Plessey integrates optics into CSP LED

Lumileds has announced its CSP-based FlipChip White LED intended for general illumination applications, while Plessey has developed a way to customize primary optics on a CSP LED in the manufacturing process. The original version of this article can be found...

Understand both static and transient thermal management in LED-based developments (MAGAZINE)

Giles Humpston explains the intricacies of cooling LEDs and modeling the thermal path to ensure reliable solid-state lighting product developments. The original version of this article can be found...

IES explores luminuous flux maintenance projection method developments using LM-80 data

The IES is considering feedback from the LED industry on projection methods for testing and defining additional long-term behavior changes in LEDs that are not addressed in the current version of TM-21. Jianzhong Jiao describes possible models and updates under...

CSP LEDs crawl toward delivering on SSL promise (MAGAZINE)

Chip-scale packaging (CSP) technology has the potential to reduce LED component cost and provide SSL system-design advantages, explains Maury Wright, but the technology, borrowed from the mainstream semiconductor industry, has been slow to emerge commercially. The...

IES publishes lighting specification for sports fields and venues

IES RP-6-15 covers recommended lighting practices for recreational to professional sports fields and venues with specific guidelines for individual sports. The original version of this article can be found...